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Microsemi Expands its 802.11a Power Amplifier InGap HBT Wireless LAN Portfolio

2 November 2005

Microsemi Corporation (Nasdaq:MSCC), a global supplier of high performance analog/mixed signal integrated circuits, announced today that its Integrated Products Group has added a new InGap HBT power amplifier for portable 802.11a wireless local area network applications that include cardbus, mini-PCI and access point products.

The new advanced amplifier, designated the LX5506M, provides a power gain of up to 30dB operating in the 5.25GHz frequency band found in 802.11a applications. It pairs with Microsemi's recently announced LX5511 amplifier for a total solution in 802.11a/b/g applications, which include the 2.3 to 2.5GHz frequency bandwidth.

"We developed the LX5506M to give our customers another option from our growing line of wireless LAN power amplifiers," said Paul Bibeau, Sr. Vice President and General Manager of Microsemi's Integrated Products Group. "We've been at the forefront of WLAN power amplifier designs for many years," he said.

According to ABI Research, integrated circuit shipments into the WiFi market are projected to have a 40% compound annual growth rate heading to the year 2010. Analysts credit such growth projections to the continuing expansion of consumer applications of WLAN technology.

LX5506M power amplifiers feature active bias, on-chip input matching and output pre-matching, plus the low current consumption required in portable applications. It also features a temperature-compensated output power detection circuitry which provides excellent accuracy of less than +/- ldB from -40 to +85 degrees C over the entire 4.9 to 5.85 GHz frequency range.

The LX5506M amplifier operates from a single 3.3V supply. It offers excellent thermal characteristics from its 16-pin micro-lead package which features a built-in heat sink and a footprint that's only 0.9mm high and 3mm square.

Priced in 10k lot quantities at $0.85, the LX5506M is available for immediate sampling and in pre-production quantities. Complete technical information on Microsemi's full line of wireless LAN products is available on the Microsemi web site, http://www.Microsemi.com. Samples can be ordered through this site or from Microsemi sales representatives and authorized distributors.

About Microsemi Corporation

Microsemi Corporation, with corporate headquarters in Irvine, California, is a leading designer, manufacturer and marketer of high performance analog and mixed-signal integrated circuits and high reliability semiconductors. The company's semiconductors manage and control or regulate power, protect against transient voltage spikes and transmit, receive and amplify signals.

Microsemi's products include individual components as well as integrated circuit solutions that enhance customer designs by improving performance and reliability, battery optimization, reducing size or protecting circuits. The principal markets the company serves included implanted medical, defense/aerospace and satellite, notebook computers, monitors and LCD TVs, automotive and mobile connectivity applications. More information may be obtained by contacting the company directly or by visiting its web site at http://www.microsemi.com.

PLEASE READ THE FOLLOWING FACTORS THAT CAN MATERIALLY AFFECT MICROSEMI'S FUTURE RESULTS.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in the news release that are not entirely historical and factual in nature are forward-looking statements. For instance, all statements of belief and expectations are forward-looking statements. Forward-looking statements are inherently subject to risks and uncertainties, some of which cannot be predicted or quantified. Potential risks and uncertainties include, but are not limited to, such factors as changes in generally accepted accounting principles, the difficulties regarding the making of estimates and projections, including difficulties with periodic fluctuation and possible changes of numerous factors, difficulties in the hiring and retention of qualified personnel in a competitive labor market, acquiring and integrating new operations or assets, closing or disposing of operations or assets, or difficulties in transferring work from one plant to another, rapidly changing technology and product obsolescence, difficulties predicting the timing and amount of plant closure costs, the potential inability to realize cost savings or productivity gains and to improve capacity utilization, potential cost increases, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, results of in-process or planned development or marketing and promotional campaigns, changes in demand for products, difficulties foreseeing future demand, effects of limited visibility of future sales, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, business disruptions, epidemics, disasters, wars or potential future effects of the tragic events of September 11, variations in customer order preferences, reductions or changes in defense spending, fluctuations in the costs of legal compliance, including compliance with the Sarbanes-Oxley Act of 2002, fluctuations in other costs of general and administrative kinds, fluctuations in market prices of the company's common stock and potential unavailability of additional capital on favorable terms, difficulties in implementing company strategies, dealing with environmental matters or litigation, difficulties in determining and maintaining adequate insurance coverage, difficulties protecting patents and other proprietary rights, inventory obsolescence and customer qualification of products, manufacturing facilities and processes. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors shall be identified from time to time in Microsemi's future filings. Microsemi does not undertake to supplement or correct any information in this release that is or becomes incorrect.

Investor Inquiries: David R. Sonksen, Microsemi Corporation, Irvine, CA (949) 221-7101.

The Microsemi Corporation logo can be found at: http://www.primezone.com/newsroom/prs/?pkgid=1233

CONTACT: Microsemi Corporation
FINANCIAL CONTACT: David R. Sonksen
Executive Vice President and CFO
Tel: (949) 221-7101

EDITORIAL CONTACT: Cliff Silver
Manager, Corporate Communications
Tel: (949) 221-7112

Source: Prime Zone



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