Silansys joins Texas Instruments OMAP™ Developer Network3 February 2005
Silansys Technologies Ltd (www.silansys.com), a leading developer of embedded multimedia firmware and silicon for mobile devices, today announced that it has become a member of Texas Instruments Incorporated’s (TI’s) OMAP™ Developer Network, joining a group of leading applications developers driving the next generation of multimedia applications for wireless devices.
The highly innovative Silansys MoMedia audio solution performs high quality, high polyphony sound synthesis, especially targeted at low-to-mid ranged phones. The extremely low MIPS, low memory architecture now enables high polyphony sound synthesis through software for low-cost platforms with baseband processors and delivers ultra-low power in handsets with high performance applications processors. Utilizing TI’s industry-proven multi-core OMAP architecture, MoMedia gains an additional dimension of performance optimization, enabling an extremely low power solution.
“We’re delighted to have joined TI’s OMAP Developer Network and demonstrate the high quality sound of Silansys MoMedia technology on the OMAP platform,” says Sean Mitchell, VP & General Manager of Multimedia Applications at Silansys. “TI’s high-performance, low-power OMAP processors allow us to showcase high polyphony sound synthesis to deliver polyphonic ringtones, 3D surround sound and mobile gaming with significant power and cost savings to handset OEMs.”
“The low processing requirements of the Silansys MoMedia sound synthesis technology on TI’s OMAP processors delivers polyphonic capability in fewer MIPs, thereby enabling more functions to be run simultaneously on handsets,” says Bryce Johnstone, worldwide OMAP Developer Network manager. “Silansys MoMedia with TI’s OMAP processors will deliver polyphonic ringtones, 3D surround sound and more to a broader range of mobile phones.”
Silansys is actively marketing the MoMedia technology to handset customers worldwide and the cooperation with TI will help to enable the broadest possible adoption of the technology.
About the OMAP Developer Network
Silansys is a member of TI’s OMAPTM Developer Network, a group of leading software developers porting advanced applications to TI’s high performance, power-efficient OMAP processors. Handset manufacturers adopting OMAP devices enjoy the rapid deployment of compelling wireless applications – including streaming audio and video, multimedia messaging, gaming, security, speech recognition, location based services and mobile commerce – across all leading operating systems. Systems level integration services are also provided worldwide by independent OMAP Technology Centers. The OMAP platform has been selected by leading manufacturers, such as Nokia, Palm, NEC, Fujitsu, LG Electronics, Hewlett-Packard, Sendo, HTC and many more, for their 2.5 and 3G wireless devices. For more information, please visit www.ti.com/omap.
About Silansys Technologies Ltd
Silansys Technologies is a leading developer of multimedia software and silicon for mobile devices. Silansys’ pioneering Audio DSP technology enables low-cost and low-power sound synthesis in mobile handsets and media players. Silansys is working with top tier semiconductor companies to develop next-generation micro-HDD storage solutions and low-power Connectivity for portable consumer applications. Silansys’ turn-key custom product development solutions integrate a full range of silicon SoC technology from CMOS RF to mixed-signal and DSP, through to embedded firmware. For more information, please visit www.silansys.com.
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Source: PR Web
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