STATS ChipPAC Schedules Second Quarter 2005 Results Conference Call

STATS ChipPAC Ltd. ("STATS ChipPAC"or the "Company") (NASDAQ: STTS) and (SGX: STATSChP), a leading independent semiconductor test and advanced packaging service provider,
today announced that it will hold a conference call with investors and
analysts on Thursday, July 28, 2005 at 8:00 a.m. in Singapore to discuss
results for the Company's second quarter 2005 and business outlook. This
will be 8:00 p.m. on Wednesday, July 27, 2005 in New York.

The news release announcing the second quarter 2005 results will be
disseminated on July 27, 2005 after the Nasdaq stock market closes.

The dial-in number for the live audio call beginning at 8:00 a.m. Singapore
time on Thursday, July 28, 2005 (8:00 p.m. in New York on Wednesday, July
27, 2005) is +1-201-689-8261. The password confirmation is 157834. A live
webcast of the conference call will be available on STATS ChipPAC's website
at

A replay of the call will be available immediately following the call
through noon on Thursday, August 4, 2005 in Singapore (midnight in New York
on Thursday, August 4, 2005) at and by telephone
at +1-201-612-7415. The account number to access the replay is 3055 and the
conference ID number is 157834.

About STATS ChipPAC Ltd.

STATS ChipPAC Ltd. ("STATS ChipPAC" or "the Company" -- NNM: STTS and SGX:
STATSChP), is a leading service provider of semiconductor packaging design,
assembly, test and distribution solutions. A trusted partner and supplier
to leading semiconductor companies worldwide, STATS ChipPAC provides fully
integrated, multi-site, end-to-end assembly and testing solutions that
bring products to market faster. Our customers are some of the largest
wafer foundries, integrated device manufacturers (IDMs) and fabless
companies in the United States, Europe and Asia. STATS ChipPAC is a leader
in mixed signal testing and advanced packaging technology for
semiconductors used in diverse end market applications including
communications, power, digital consumer and computing. With advanced
process technology capabilities and a global manufacturing presence
spanning Singapore, South Korea, China, Malaysia and Taiwan, STATS ChipPAC
has a reputation for providing dependable, high quality test and packaging
solutions. The Company's customer support offices are centered in the
United States (California's Silicon Valley, Arizona, Texas, Massachusetts,
Florida, Colorado and North Carolina). Our offices outside the United
States are located in the Netherlands, United Kingdom, China, Singapore,
Japan, Taiwan, South Korea and Malaysia. STATS ChipPAC's facilities
include those of its subsidiary, Winstek Semiconductor Corporation in
Hsinchu Valley, Taiwan. These facilities offer new product introduction
support, pre-production wafer sort, final test, packaging and other high
volume preparatory services. Together with our research and development
centers in Singapore and South Korea as well as test facilities in the
United States, this forms a global network providing dedicated test
engineering development and product engineering support for customers from
design to volume production. STATS ChipPAC is listed on both the Nasdaq
National Market and The Singapore Exchange. In addition, STATS ChipPAC is
also listed on the Morgan Stanley Capital International (MSCI) Index and
the Straits Times Industrial Index. Further information is available at
Information contained in this website does not
constitute a part of this corporate release.

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