TeleCIS Wireless Names Industry Veteran, Dr. Sanjeev Renjen, As SVP Of Engineering and Operations

8 July 2005

TeleCIS Wireless, Inc., a leading developer of multi-protocol broadband wireless access (BWA) chips, today named Dr. Sanjeev Renjen as the company's Senior Vice President of Engineering and Operations. In that role, Dr. Renjen will oversee the company's product development and production of its WiMAX/MIMO and WiMAX/WiFi/MIMO ASICs. The company plans to launch its first product, a fully-compliant 802.16-2004/WiMAX/MIMO System-on-a-Chip (SoC) ASIC for nomadic and fixed applications, in Q1 2006.

Dr. Renjen has more than 20 years of senior management and technical experience in the development and manufacture of advanced silicon chip products at both small and large corporations with high growth rates. Most recently, he served as a director at Intel Corporation, where he led several chipset design and development programs. Dr. Renjen led the development and production of two VoP (voice over packet) chips designed in TSMC's .18 and .13 micron processes. He also developed a SONET OC-3, -12 and -48 layer 1 and 2 framer chip designed in Intel's 90nm process.

Dr. Renjen has led successful development and product launch efforts and contributed substantially to the bottom line at several other chip companies as well, including Vxtel Inc., Paradise Electronics, and Nimbus Technology. Each company was subsequently acquired by Intel, Genesis Micro and Alliance Semiconductor, respectively. His achievements consistently enabled significant revenue ramps at these and other companies, including C-Cube Microsystems, whose revenue rose from $20M to $650M over the course of his 3-year tenure.

"Sanjeev's reputation in leading technologies from design to silicon and into volume production in very short timeframes truly precedes him, and we are excited to have him on board," said Sam Endy, CEO of TeleCIS Wireless. "I cannot imagine a more effective duo than Sanjeev and our CTO, Dr. Je Woo Kim, to get us established in one of the most promising markets of this decade - WiMAX."

The company is developing high performance 802.16/WiMAX/MIMO chips targeting terminal devices in the nomadic and mobile broadband markets. The company's first chip, addressing the WiMAX nomadic market, will deliver exceptional performance that enables indoor fixed service as well as full nomadic portability within a service area. The TeleCIS WiMAX/MIMO Nomadic chip can be incorporated into a PC card and installed into a laptop or other mobile devices, meeting a majority of the consumer's mobile broadband needs before 802.16e/WiMAX mobile systems are available. Ultimately, TeleCIS Wireless plans to deliver multi-protocol broadband wireless chips that combine 802.16e/WiMAX/MIMO "mobile" and the company's WiFi protocols in a single ASIC, allowing end-users to seamlessly connect to the most appropriate network on an anytime and anywhere basis and provide a compelling solution for WiMAX operators, user terminal device manufacturers and end-users.

"The TeleCIS team and market opportunity reminds me of exciting experiences I've had with Vxtel, Paradise and C-Cube," said Dr. Renjen. "I look forward to helping TeleCIS achieve its full potential in the Broadband Wireless space."

Dr. Renjen holds a BS degree in Electronics from Birla Institute of Technology and Science in India, and a MS degree in Electrical Engineering from the University of South Carolina, Columbia. He received his PhD in Electrical Engineering from the University of Illinois.

About TeleCIS Wireless

TeleCIS Wireless, Inc. (www.telecis.com) is a Silicon Valley-based, fabless semiconductor company dedicated to delivering multi-protocol wireless System-on-a-Chip (SoC) solutions with industry leading range and quality of service. Founded in January 2000 to develop chipsets for the WLAN market, the company has 3 commercial WiFi designs to its credit as well as smart antenna technologies. The Company is using the expertise gained through years of WiFi and OFDM and smart antenna experience to develop SoC Broadband Wireless MIMO chipsets, the first supporting WiMAX Nomadic, followed by a multi-protocol SoC supporting WiMAX Mobile and WiFi protocols in a single ASIC.

Source: Business Wire